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SURMOUNT TM 5 m PIN Diodes--MADP-042305-130600, MADP-042405-130600, MADP-042505-130600, MADP-042905-130600
Features
* * * * * * * Surface Mount, 5 m I-Region Length Device No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance Higher Average and Peak Power Handling
MADP-042005 Series V2
Absolute Maximum Ratings1 @ TA = +25 C (unless otherwise specified)
Parameter Part Forward Current Reverse Voltage Operating Temperature Storage Temperature Junction Temperature C.W. Incident Power (dBm) Mounting Temperature 40 44 042 305 Absolute Maximum 042 405 250 mA l -80 V l -55 C to +125 C -55 C to +150 C +175 C 43 35 042 505 042 905
Description and Applications
This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM's patented HMICTM process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This Vertical Topology provides for Exceptional Heat Transfer. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. These packageless devices are suitable for usage in Moderate Incident Power ( 10 W C.W. ) and 50 W , 1 uS, 0.01 Duty Cycle, Peak Power, Series, Shunt, or Series-Shunt Switches. Smaller Parasitic Inductance, 0.4 nH, and Excellent RC Constant, make the devices ideal for Higher Frequency Switch Elements compared to their Plastic Device Counterparts.
+300 C for 10 seconds
1. Operation of this device above any one of these parameters may cause permanent damage.
Case Style ODS-1306
A
B
C
Bottom Side Contacts are Circuit Side
Dim A B C D E F G
1
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information.
Inches Min. Max. 0.040 0.042 0.021 0.004 0.013 0.011 0.013 0.019 0.023 0.008 0.015 0.013 0.015 0.021
Millimeters Min. Max. 1.025 1.075 0.525 0.102 0.325 0.275 0.325 0.475 0.575 0.203 0.375 0.325 0.375 0.525
G
D
E
F
1. Backside Metal: 0.1microns thick. 2. Shaded Areas Indicate Backside Ohmic Gold Contacts. 3. Both Devices have Same Outline Dimensions ( A to G ).
* North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information.
SURMOUNT TM 5 m PIN Diodes--MADP-042305-130600, MADP-042405-130600, MADP-042505-130600, MADP-042905-130600
Electrical Specifications @ + 25 C
Parameter Symbol Conditions Units Min Typ MADP-042305 Max
MADP-042005 Series V2
Min Typ MADP-042505 Max
Capacitance Capacitance Capacitance Capacitance Resistance Resistance Forward Voltage Reverse Leakage Current Input Third Order Intercept Point C.W. Thermal Resistance Lifetime
CT CT CT CT RS RS VF IR
- 10 V, 1 MHz 1 - 10 V, 1 GHz 1,3 - 40 V, 1 MHz 1 - 40 V, 1 GHz 1,3 + 20 mA, 1 GHz 2,3 + 50 mA, 1 GHz 2,3 + 10 mA | -80V | F 1= 1000MHz F2 = 1010MHz Input Power = +20dBm I bias = + 20 mA IH=0.5A, IL=10 mA +10 mA / -6 mA ( 50 % - 90 % V )
pF pF pF pF V uA
0.14 0.15 0.13 0.14 1.32 1.18 0.87
0.22 0.22
1.00 10
0.28 0.28 0.27 0.27 0.83 0.76 0.84
0.40 0.40
1.00 10
IIP3
dBm C/W nS
Min
72
76
RJL
TL
145 180
Typ MADP-042405 Max Min
115 210
Typ MADP-042905 Max
Parameter
Symbol
Conditions
Units
Capacitance Capacitance Capacitance Capacitance Resistance Resistance Forward Voltage Reverse Leakage Current Input Third Order Intercept Point C.W. Thermal Resistance Lifetime
1. 2. 3. 4. 2
CT CT CT CT RS RS VF IR
- 10 V, 1 MHz 1 - 10 V, 1 GHz 1,3 - 40 V, 1 MHz 1 - 40 V, 1 GHz 1,3 + 20 mA, 1 GHz 2,3 + 50 mA, 1 GHz 2,3 + 10 mA | -80V | F 1= 1000MHz F2 = 1010MHz Input Power = +20dBm I bias = + 20 mA IH=0.5A, IL=10 mA +10 mA / -6 mA ( 50 % - 90 % V )
pF pF pF pF V uA
0.61 0.61 0.57 0.58 0.62 0.58 0.82
0.75 0.75
1.00 10
0.06 0.06 0.06 0.06 3.14 2.60 0.93
0.18 0.18
1.00 10
IIP3
dBm C/W nS
80
65
RJL
TL
100 255
185 140
Total capacitance, CT, is equivalent to the sum of Junction Capacitance ,Cj, and Parasitic Capacitance, Cpar. Series resistance RS is equivalent to the total diode resistance : Rs = Rj ( Junction Resistance) + Rc ( Ohmic Resistance) Rs and CT are measured on an HP4291A Impedance Analyzer with die mounted in an ODS-1134 package with Sn 60/Pb 40 Solder Steady-state RJL measured with die mounted in an ODS-1134 package with Sn 60/Pb 40 Solder.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information.
* North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information.
SURMOUNT TM 5 m PIN Diodes--MADP-042305-130600, MADP-042405-130600, MADP-042505-130600, MADP-042905-130600
Handling Procedures
MADP-042005 Series V2
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized.
Bonding Techniques
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently located on the bottom surface of these devices and are removed from the active junction locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of 80 Au / 20 Sn @ ~ + 280 C or Sn 60 / Pb 40 ~ + 185 C solder is recommended. Conductive silver epoxy for die attachment ~ + 150 C may also be used for lower Incident power ( < 1 W Average Power ) applications. When soldering these devices to a hard substrate, hot gas die bonding is preferred. We re-commend utilizing a vacuum tip and force of 60 to100 grams applied normal to the top surface of the device. When soldering to soft substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top surface of the die. The solder joint must Not be made one at a time, creating un-equal heat flow and thermal stress. Solder reflow should Not be performed by causing heat to flow through the top surface of the die. Since the HMIC glass is transparent, the edges of the mounting pads closest to each other can be visually inspected through the die after attach is completed. A typical profile for a Sn 60/ Pb 40 Soldering process is provided in Application Note, " M538 " , " Surface Mounting Instructions " on the MA-COM website www.macom.com
3
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information.
* North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information.
SURMOUNT TM 5 m PIN Diodes--MADP-042305-130600, MADP-042405-130600, MADP-042505-130600, MADP-042905-130600
MADP-042005 Series Typical Performance Curves @ +25 C
Ct vs V
Ct @ 1GHz 0.800 0.700 0.600 0.500 Ct (pF) 0.400 0.300 0.200 0.100 0.000 0 5 10 15 20 Bias (V) 25 30 35 40 042505 042305 042905 0.100 0.001 042405 10.000
MADP-042005 Series V2
Rs vs I
Rs @ 1GHz
042905 042305 1.000 042505 042405
Rs (ohm)
0.010 Bias (A)
0.100
Ct vs F
Ct @ 10V 0.700 042405 0.600 0.500 Ct (pF)
Ct vs F
Ct @ 40V 0.700 042405 0.600 0.500 Ct (pF) 0.400 0.300 0.200 0.100 042905 0.000 0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+ 00 08 08 08 08 09 09 09 09 09 Freq (Hz) 042505
0.400 0.300 0.200 0.100 042905 0.000 0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+ 00 08 08 08 08 09 09 09 09 09 Freq (Hz) 042505
042305
042305
Rs vs F
Rs @ 10mA 4.50E+00 042905 4.00E+00 3.50E+00 3.00E+00 Rs (ohm) 2.50E+00 2.00E+00 1.50E+00 042505 1.00E+00 5.00E-01 042405 0.00E+00 0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+ 00 08 08 08 08 09 09 09 09 09 Freq (Hz) 042305
Rs vs F
Rs @ 20mA 4.00E+00 042905 3.50E+00 3.00E+00 Rs (ohm) 2.50E+00 2.00E+00 1.50E+00 1.00E+00 042305 042505
5.00E-01 042405 0.00E+00 0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+ 00 08 08 08 08 09 09 09 09 09 Freq (Hz)
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M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information.
* North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information.

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